• 产品型号 HSB15-404010
  • 品牌 CUI Devices
  • RoHS Yes
  • 描述 HEAT SINK, BGA, 40 X 40 X 10 MM
  • 分类 散热片
  • PDF PDF
  • 库存 2347

技术参数

  • Material Aluminum Alloy
  • Length 1.575" (40.00mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 1.575" (40.00mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 6.3W @ 75°C
  • Thermal Resistance @ Forced Air Flow 3.90°C/W @ 200 LFM
  • Thermal Resistance @ Natural 11.84°C/W
  • Fin Height 0.394" (10.00mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

相关产品


HEATSINK BGA W/ADHESIVE TAPE

库存: 2138

HEATSINK BGA W/ADHESIVE TAPE

库存: 2905

FAN AXIAL 30X8MM 5VDC

库存: 1500

ADHESIVE - THERMAL CONDUCTIVE EP

库存: 1615

HEAT SINK, BGA, 14 X 14 X 6 MM

库存: 1500

HEAT SINK, BGA, 20 X 20 X 9 MM

库存: 1500

HEAT SINK, BGA, 40 X 40 X 18 MM

库存: 2658

HEAT SINK, BGA, 40 X 40 X 25 MM

库存: 1689

THERM TAPE 43X43MM W/ADH WHT

库存: 1507

HEATSINK ALUM ANOD

库存: 1500

Top