技术参数

• Material Copper
• Length 0.591" (15.00mm)
• Shape Rectangular, Fins
• Type Board Level
• Width 1.020" (25.91mm)
• Package Cooled TO-263 (D²Pak)
• Attachment Method SMD Pad
• Power Dissipation @ Temperature Rise 2.0W @ 40°C
• Thermal Resistance @ Forced Air Flow 5.00°C/W @ 400 LFM
• Fin Height 0.375" (9.52mm)
• Material Finish Tin
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) Not Applicable