技术参数

• Material Copper
• Length 0.763" (19.38mm)
• Shape Rectangular, Fins
• Type Board Level
• Width 1.000" (25.40mm)
• Package Cooled TO-263 (D²Pak)
• Attachment Method SMD Pad
• Power Dissipation @ Temperature Rise 1.5W @ 20°C
• Thermal Resistance @ Forced Air Flow 4.00°C/W @ 200 LFM
• Fin Height 0.450" (11.43mm)
• Material Finish Tin
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) Not Applicable