技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Diode Type Single
• Operating Temperature -65°C ~ 175°C
• Capacitance @ Vr, F 0.6pF @ 4V, 1MHz
• Q @ Vr, F 6500 @ 4V, 50MHz
• Capacitance Ratio Condition C0/C30
• Supplier Device Package Chip
• Voltage - Peak Reverse (Max) 30 V
• Capacitance Ratio 2.8
• ECCN EAR99
• HTSUS 8541.10.0070
• Moisture Sensitivity Level (MSL) 1 (Unlimited)