技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Diode Type Single
• Capacitance @ Vr, F 0.55pF @ 4V, 1MHz
• Q @ Vr, F 3000 @ 4V, 50MHz
• Supplier Device Package Chip
• Voltage - Peak Reverse (Max) 18 V
• ECCN EAR99
• HTSUS 8541.10.0070
• Moisture Sensitivity Level (MSL) 1 (Unlimited)