技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Diode Type Single
• Operating Temperature -65°C ~ 150°C
• Capacitance @ Vr, F 0.5pF @ 4V, 1MHz
• Q @ Vr, F 3000 @ 4V, 50MHz
• Capacitance Ratio Condition C2/C12
• Supplier Device Package Die
• Voltage - Peak Reverse (Max) 18 V
• Capacitance Ratio 6.5
• ECCN EAR99
• HTSUS 8541.10.0060
• Moisture Sensitivity Level (MSL) 1 (Unlimited)