Technical Details

• Material Copper
• Length 0.315" (8.00mm)
• Shape Rectangular, Fins
• Type Top Mount
• Width 0.900" (22.86mm)
• Package Cooled TO-252 (DPak)
• Attachment Method SMD Pad
• Power Dissipation @ Temperature Rise 2.5W @ 35°C
• Thermal Resistance @ Forced Air Flow 17.50°C/W @ 300 LFM
• Fin Height 0.400" (10.16mm)
• Material Finish Tin
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) Not Applicable