Technical Details
- Material Copper
- Shape Rectangular
- Type Board Level
- Package Cooled Raspberry Pi 3 B+
- Attachment Method Thermal Tape, Adhesive (Included)
- ECCN EAR99
- HTSUS 8414.59.6595
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
Related Products
ALUMINUM ALLOY CNC HEAT SINK WIT
In Stock: 39
ALUMINUM ALLOY CNC HEAT SINK WIT
In Stock: 54
RASPBERRY PI COOLING DUAL FAN
In Stock: 3
ARMOR LITE HEAT SINK WITH PWM FA
In Stock: 62
RASPBERRYPIDUALCOOLINGFANSKIT (C
In Stock: 20
BLACK ALUMINUM HEATSINKKIT FOR R
In Stock: 0
