Technical Details

• Material Aluminum
• Diameter 0.300" (7.62mm) ID, 1.125" (28.57mm) OD
• Shape Cylindrical
• Type Board Level
• Package Cooled BGA
• Attachment Method Thermal Tape, Adhesive (Not Included)
• Power Dissipation @ Temperature Rise 1.5W @ 40°C
• Thermal Resistance @ Forced Air Flow 8.00°C/W @ 400 LFM
• Material Finish Black Anodized
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) Not Applicable
• RoHS Status ROHS3 Compliant